An Embedded-Ready Subsystem (ERS) combines the high-performance processing and leading-edge system I/O capabilities of Computer-On-Modules (COMs) with the modular expansion flexibility of stackable single board computers, all within a single compact, rugged, reliable, pre-integrated module. Additionally, the modules' large thermally-conductive baseplate provides both an efficient cooling solution and a standardized mounting-hole pattern that ensures interchangeability for alternate features or performance upgrades.
An ERS consists of three layers, as illustrated below. The central core of the ERS is its COM layer. Below the COM layer is the thermally-conductive baseplate layer. Above the COM layer is the application layer, which provides I/O interface connectors, expansion module sockets, and in many cases additional functionality.
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